... have the following HDI PCB manufacturing capabilities:Buried, Blind and Micro ViasNCVFCopper FillSequential Lamination3/3 Traces/Space5% ... OEM&ODM,Free Samples,Special Requirements Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger ... .075mm-5mmTaphole aperture0.2mm-0.6mmSpecial technologyIndepedance,Blind buried via,thick gold,aluminum PCBSurface finishHASL,Lead free ...