1.thermally conductive 2.assembly of heatsink and DDR-RAM module 3.assembly of LED light bar module and metal frame bezel
Structure:
It is a thermally conductive adhesive tape designed to provide an efficient method of mounting heat sinks onto devices such as microprocessor, small electronic packages and other components.
It eliminates the need for clips, clamps, other forms of mechanical fixing and messy thermal compound.
It consists of a highly conductive aluminum foil coated on both sides with thermally conductive high strength adhesive.
We can supply this tape in rolls, sheets or individual shapes.
1.carrier: aluminum foil
2.thickness:0.125mm, 0.18mm
3.log roll: 1030mm x 50m
4.long term temperature resistance: 120°C
5.short term temperature resistance: 180°C
Double Sided Thermally Conductive Adhesive Tape
