ULTRAVIOLET LASER MARKING MACHINE HBS-ZG-3Technical ParameterModel HBS-ZG-3 HBS-ZG-5Laser Wavelength 355nm 266nmLaser Power 3w /5wMarking Area 50×50mm/100×100mmMarking Speed ≤7000mm/sBeam Quality <2Q Frequency Tuning 8Khz-15KhzMin. Line Width 0.01mmMin. Character Size 0.2mmRepetition Accuracy ±0.003mmPower Consumption 2kwPower Supply 220V/ Single-Phase/50Hz/10AProduct IntroductionUltraviolet Laser Marking Machine is self-developed by HBS and has the world's most advanced technology. It has following features: high electro-optical conversion rate, long working time of nonlinear crystal, high stability, high positioning accuracy, high operation efficiency, optimized modular design for convenient installation and maintenance. Equipped with two-dimensional automated workstation, it can realize marking continuously in multi-stage or large-size marking. The laser marking line is very fine that suitable for marking with high demand, it's mainly applied to mark the products such as LCD screen, IC wafer and IC chips.Applicable Materials & IndustryMainly used in the marking and surface processing of materials such as of all sorts of glass, TFT, LCD screen, Plasma screen, textile products, ceramic chip, mono-crystal silicon wafer, IC chip, sapphire and thin polymer film. The main advantage of Ultraviolet laser is in the complementing of the shortcoming of other bandwidth lasers in precision machining and processing of special materials.
