Metal Bond Diamond BladesProducts DescriptionMetal bond diamond blades, the sintered diamond blades with the addition of metal powder in bond, have high retaining force for grain. With the higher wear-resistance and advanced cutting capability and higher stiffness, the metal bond blades can effectively reduce cutting defects like slanted-kerf.Application Mainly used for cutting sapphire, single crystal silicon, quartz, semiconductor materials, chip, PCB, silicon carbide and carbon fiberAdvantages 1. High-Precision,large depth and narrow kerf 2. Smooth&fast cutting without chipping3. Long life span and stable performance4. Competitive price and superior quality5. Safe package and fast delivery6. Professional & excellent serviceItemSpecificationOD50-125mmID25.4/40/88.9Grit200#-5000# (D107-D1)Thickness0.10-2.00mm (Based on diamond grit size)According to customers’ requirement Email: [email protected] Bond Agent:※Resin bond & metal bond & electroplated