hdi pcb 100% electrical performance testing,high pressure testing High TG board, high frequency board halogen-free boar
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Detailed specification of manufaturing capacity: Surface processing type HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/OSP processing/immersion Tin (Sn) Layers single-sided,double-sided,4 layers Min trace width 6mil Min space width 6mil Min trace to pad/pad to pad space 6mil Min drill diameter 0.2mm Min via pad 0.6mm Max board size 560mmX720mm Molding board thickness 0.6-3.00mm Min solder mask dam 6mil Min solder mask clearance 1.5mil Min solder mask thickness 10um Solder mask type Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue. Min silk legend width 6mil Min silk legend height 25mil Silk legend color White/ yellow /black Data file format GERBER file and corresponding drilling file,PROTEL series,PADS2000,POWERPCB series,ODB++Gerber file and Corresponding Broach file, PROTEL series,PADS2000,POWERPCB series, ODB++ Electricity performance testing Electricity performance testing 100% electrical performance testing,high pressure testing100%electricity performance testing, high-pressure testing Various types base material to PCB processing High TG board, high frequency board(ROGERS,TEFLON) halogen-free board (FR-4,CEM-1,CEM-3) Other testing request Impendence testing, Hole resistance testing, gold slice up, Solder ability.
hdi pcb
