Polyimide film * High mechanical, electrical properties. * Excellent flexibility. * Lower coefficient of thermal expansion
Polyimide film
Typical properties:
Type | PIF-25H | PIF-50H | PIF-75H |
Typical thickness mm | 0.025 | 0.050 | 0.075 |
Thickness tolerance mm | ±0.003 | ±0.003 | ±0.004 |
Basic Weight g/m2±10% | 35 | 70 | 105 |
Width mm | 10~635, on customers' demand | 10~520, on customers' demand | |
Supply size | Supplied in rolls; core diameter: 76mm | ||
* Other thickness are available on customers’ demand
Properties:
Property items | Test methods | Units | Typical Value |
1. Visual | The surface should be even and free from wrinkle, blister, adhesive particle and impurity. | ||
2. Density | ASTM D1505 | g/cm3 | 1.42 |
3. Tensile strength | IPC-TM-650 Method 2.4.19 | Mpa | ≥180 |
4. Elongation | % | ≥45 | |
5. Tensile Modulus (MD) | 2.3 | ||
6. Dielectric strength | ASTM D149 | kV/mm | ≥180 |
7. Volume resistivity | ASTM D257 | m | >1 x 1010 |
8. Surface resistivity | ASTM D257 | > 1 x 1014 | |
9. Dielectric constant | IPC-TM-650 Method 2.5.5.3(1MHz) | 3.4 | |
10. Dissipation factor | 0.0018 | ||
11. Dimensional Stability | IPC TM 650, Method 2.2.4A | % | ≤0.25 |
12. Coefficient of thermal expansion | Ppm/°C | 27 | |
13. Moisture absorption | IPC-TM-650,Method2.6.2 | % | 2.5 |
14. Flammability | UL-94 | V-0 | |
Application:
D&T IH polyimide film is always the best choice of high performance polymer materials, especially for the application of electronic and IC industries that have strict materials specification. PI is in the position of key materials, such as high temperature tape, FPC, IC passivation coating, LCD alignment layer, and insulated materials, etc.
D&T- commodity name registered by Tecnidd, UL recognition no. E219327
Best Quality Polyimide film
