HDI PCB with BGA, Blind and Buried via, Made of FR4 Material
HDI PCB with BGA, Blind and Buried via, Made of FR4 Material 1.UL,SGS,ROHS,IS09001,CE,IPC 2..High quality&competitive price
HDI PCB with BGA, Blind and Buried via, Made of FR4 Material
1.Base Material:fr4
2.copper thickness:2oz
3.board thickness:1.6mm
4.Surface treatment:ENIG
5.layer:4-layer
productive power:
| Specification Inch (mm) | ||
| Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium | |
| Layer No. | 1-30 | |
| Board thickness | 0.015" (0.4mm)-0.125" (3.2mm) | |
| Board Thickness Tolerance | ± 10% | |
| Cooper thickness | 1/2OZ-3OZ | |
| Impedance Control | ± 10% | |
| Warpage | 0.075%-1.5% | |
| Peelable | 0.012" (0.3mm)-0.02’ (0.5mm) | |
| Min Trace Width (a) | 0.005" (0.125mm) | |
| Min Space Width (b) | 0.005" (0.125mm) | |
| Min Annular Ring | 0.005" (0.125mm) | |
| SMD Pitch (a) | 0.012" (0.3mm) | |
| BGA Pitch (b) | 0.027" (0.675mm) | |
| Regesiter torlerance | 0.05mm | |
| Min Solder Mask Dam (a) | 0.005" (0.125mm) | |
| Soldermask Clearance (b) | 0.005" (0.125mm) | |
| Min SMT Pad spacing (c) | 0.004" (0.1mm) | |
| Solder Mask Thickness | 0.0007" (0.018mm) | |
| Hole size | 0.01" (0.25mm)-- 0.257" (6.5mm) | |
| Hole Size Tol (+/-) | ± 0.003" (± 0.0762mm) | |
| Aspect Ratio | 6: 1 | |
| Hole Registration | 0.004" (0.1mm) | |
| Plating | ||
| HASL | 2.5um | |
| Lead free HASL | 2.5um | |
| Immersion Gold | Nickel 3-7um Au: 1-3u' ' | |
| OSP | 0.2-0.5um | |
| Outline | ||
| Panel Outline Tol (+/-) | ± 0.004' ' (± 0.1mm) | |
| Beveling | 30° 45° | |
| V-cut | 15° 30° 45° 60° | |
| Certificate | ROHS ISO9001: 2000 TS16949 SGS UL | |
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HDI PCB with BGA, Blind and Buried via, Made of FR4 Material
