PCBA
1.OEM pcba,SMT,DIP and final assembly; 2.Components source; 3.Packing box build&logistics management; 4.Capacity:2,000,000p/d
PCB Assembly products field:
Industrial control | Alarm products | Measurement device |
Telecom audio and video
|
Consumer electronics |
| Our Capability: |
| 1. Bare Board Fabrication |
| 2. Full Component Procurement |
| 3. SMT/BGA/DIP Assembly |
| 4. Inspection/Function Test of Finished Goods |
| 5. Shipment Arrangement |
| PCB Assembly Competence: |
1. Stencil size/range: 736*736mm |
| 2. Minimum IC pitch:0.30mm |
| 3. Maximum PCB size: 410*360mm |
| 4. Minimum PCB thickness:0.35mm |
| 5. Minimum chip size:0201 |
| 6. Maximum BGA size:74*74mm |
| 7. BGA ball pitch: 1.00mm(min), 3.00mm(max) |
| 8. BGA ball diameter:0.4mm(min), 1.0mm(max) |
| 9. QFP lead pitch: 0.38mm(min), 2.54mm(max) |
| 10.Frequency of stencil cleaning: 1 time/5 to 10 pieces |
| PCBA Equipment: |
| 1. JUKI 2050, JUKI 2020, JUKI760 and JUKI 7502---3 automated manufacturing SMT lines |
| 2. 1 Wave Soldering Line(supporting Rohs products) |
| 3. 2 Hand Manual Soldering Lines for DIP(supporting Rohs products) |
| 4. 3 Semi-automatic Printers(FSP-2015P, SP-3040A) |
| Requested Infomation for Assembly: |
| 1. Gerber files or Protell 99 of the bare PC board, Bill of Material for assembly; |
| 2. Testing guide; |
| 3. To short the leadtime, pls kindly advise us if there is any acceptable components substitution. |
PCBA
