1, fast leadtime for sample and production. 2, small order quatity accept 3, 13 years experience 4, reasonable price
NO | ITEM | Technical capabilities |
1 | Layers | 1-20 layers |
2 | Max. Board size | 2000×610mm |
3 | Min. board Thickness | 2-layer 0.15mm |
4-layer 0.4mm | ||
6-layer 0.6mm | ||
8-layer 1.5mm | ||
10-layer 1.6~2.0mm | ||
4 | Min. line Width/Space | 0.1mm(4mil) |
5 | Max. Copper thickness | 10OZ |
6 | Min. S/M Pitch | 0.1mm(4mil) |
7 | Min. hole size | 0.2mm(8mil) |
8 | Hole dia. Tolerance (PTH) | ±0.05mm(2mil) |
9 | Hole dia. Tolerance (NPTH) | +0/-0.05mm(2mil) |
10 | Hole position deviation | ±0.05mm(2mil) |
11 | Outline tolerance | ±0.10mm(4mil) |
12 | Twist & Bent | 0.75% |
13 | Insulation Resistance | >1012 Ω Normal |
14 | Electric strength | >1.3kv/mm |
15 | S/M abrasion | >6H |
16 | Thermal stress | 288°C 10Sec |
17 | Test Voltage | 50-300V |
18 | Min. blind/buried via | 0.15mm (6mil) |
19 | Surface Finished | HAL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copper base |
6 Layer PCB (Multilayer Board With Gold Finger)
