1.CF360 2.Instrument model Three temperature zone 3.Upper and lower temperature area capable of lifting Power 4000W
Worldwide shipping bga rework station CF360, for motherboard, xbox360, ps3 repairing
Model | Chinafix CF 360 |
Solder Type | Leaded Solder/Lead free |
SMD Type | Micro bga,BGA,CSP,QFP |
PCB Thickness | 0.5mm~4mm |
PCB Size | W50mm*D50mm~W455*D350mm |
Heating Mode/Power (Upper) | Hot flow /800W |
Heating Mode/Power (Bottom) | Hot flow /800W |
Preheating Mode/Power | IR 2400W |
PCB Positioning Mode | Shape or Tongs |
Driver Mode | Gear,Rack |
Control / Adjusting Mode | Temperature instrument control |
Temperature Range | Room Temperature 0~400°C |
Max Power | 4000W |
Power | 110V~220V |
Dimension | 760mm(L)*700mm(W)*600mm(H) |
packing Weight | 65 KG |
CT-360 has three heating zones, they are upper heating zone,bottome heating zone and preheating zone, and they are controlled by the relative tempreture instruments.When heating,the hot air from tuyeres on upper and bottom heat BGA chip being soldered mainly,preheater heats all the PCB.When reaching BGA chip’s melting point,the theorial tempreture must be heated to 80—110°C, to insure heating all PCB uniformly,in case of being out of shape
bga rework station CF360
Worldwide shipping bga rework station CF360, for motherboard, xbox360, ps3 repairing
