BD-ACF80 Bonding Machine is used for pasting ACF on LCD,PCB Panel.

Features:

Main(thermo-press)cylinder uses the SMC pneumatic sliding table(circulation type linear guide rail) cylinder, which has high precision; and it has set the pressure switch measuring function PLC control system, man-machine interface operation; YAMATAKE temperature controls system, permanent heating(PID control), and the temperature compensation can be established; Hot indenter attaches silicon rubber (or Teflon), (may be matched according to customers request); Both ACF feeding and receiving material use stepper motor, the feeding length is accurate, and the belt tightens automatically, besides the movement is stable; LCD template has vacuum absorption, vacuum filtration as well as the vacuum switch measuring function; The shuttle of LCD platform is driven by the cylinder, the linear guide rail guides, the movement is steady.

Specifications;

Item		Specification
LCD working size		185(L) * 110(W) mm(can customized )
LCD size		1.5~7 inch
Pressure of indenters		30~150N
Hot indenter area		60(L) * 5(W) mm
Constant temperature precision		RT~200 can be set by taking 1 as the unit
ACF width		1~5mm
ACF drawstring precision		±0.05mm
Preinstall pressure precision		0.001Mpa
Working process		3~8secis decided according to process
Sticking accuracy	X-axis	±0.15mm
	Y-axis	±0.15mm
Power Supply		AC220V 50Hz 2000VA
Rating Power		500W
Air Supply		0.4~0.6(MPa)
External Dimensions		760(L) * 603(W) * 1626(H)mm

BD-ACF80 Bonding Machine