NO

         Item

       Craft Capacity

1  

Layer 

1-30 Layers                                                        

2

Base Material for PCB

FR4, CEM-1, Aluminium,TEFLON, , Halogen-free…

3

Rang of finish baords Thickness

0.21-7.0mm

4

Max size of finish board

900*900MM

5

Minimum Linewidth

0.1mm

6

Minimum Line space

0.1mm

7

Min space between pad to pad

0.1mm

8

Minimum hole diameter

0.1mm

9

Min bonding pad diameter

10mil

10

Max proportion of drilling hole and board thickness

1:12.5

11

Minimum linewidth of Idents

4mil

12

Min Height of Idents

25mil

13

Minimun thickness of soldermask

10um

14

Sodermask color

green, black, blue, white, yellow, purple, and matt, etc

15

E-Testing

100% E-Testing (High Voltage Testing);  Flying Probe Testing

16

Special technological requirement

Blind & Buried Vias and High Thickness copper

17

Thickness of Copper

0.5-14oz (18-490um)